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Toughening of a trifunctional epoxy system: IV. Dynamic mechanical relaxational study of the thermoplastic-modified cure process
journal contribution
posted on 1997-01-15, 00:00 authored by Russell VarleyRussell Varley, J H Hodgkin, D G Hawthorne, G P SimonDynamic mechanical spectroscopy has been used to investigate the cure of a thermoplastically modified trifunctional epoxy resin. The complex dissolution, curing behavior, and variations in the glass transition of the thermoplastic (PSF) phase were described, as was the T g behavior of the epoxy phase. Prereaction of the PSF material with the epoxy resin was found to greatly increase the solubility of the PSF in the epoxy phase with little effect on the concentration of the epoxy monomer dissolving in the PSF phase. The curing behavior of the epoxy component in the thermoplastic phase was also investigated, in addition to changes in the mobility of the network at both gelation and vitrification.
History
Journal
Journal of polymer science part B: polymer physicsVolume
35Issue
1Pagination
153 - 163Publisher
WileyLocation
Chichester, Eng.ISSN
0887-6266Language
engPublication classification
C1.1 Refereed article in a scholarly journalCopyright notice
1997, John Wiley & Sons, Inc.Usage metrics
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